Terrazzo Substrate Flooring

Terrazzo Substrate Flooring

Terrazzo Substrate Flooring

Subflooring for a poured terrazzo floor

 

Concrete is the most commonly used flooring substrate in commercial construction and is particularly favored for epoxy terrazzo installations. Proper preparation of the substrate is essential for all flooring materials.

The concrete surface must be free of laitance, glaze, efflorescence, curing compounds, form-release agents, dust, dirt, grease, oil, and any other contaminants that could interfere with the terrazzo application.

In the application process, the terrazzo installer will repair and level any damaged or deteriorated concrete using a resinous fill material. After this, the installer must ensure that the concrete substrate is visibly dry and moisture-free. Next, a primer will be applied to enhance the bond between the terrazzo and the concrete slab. The primer is specifically designed to fill and seal the concrete surface effectively.

The VIA.ZZO system includes a damp proof membrane (DPM) primer, which protects against potential high-humidity “accidents” in the substrate. A moisture mitigation membrane is essential for controlling water vapor evaporation. This membrane seals the concrete and protects the terrazzo mixture from excessive moisture vapor transmission.

A crucial component of the epoxy terrazzo system, following the primer, is the application of an elastomeric plus fiber mesh membrane as an under-layer for crack bridging protection. This layer effectively blocks any potential static cracks in the substrate.

Next, divider strips are positioned according to the specified design pattern. Epoxy terrazzo can be poured seamlessly without joints for areas up to 100 square meters. For larger spaces, the divider strips serve a dual purpose: they can be used for both aesthetic design and to accommodate any potential expansion or contraction.

Once all the necessary preparations are complete, the terrazzo mixture is ready to be poured. The epoxy terrazzo mixture is troweled to a total system thickness of 15 to 20 millimeters and is subsequently ground and polished to achieve a final thickness of 13 to 18 millimeters.

After completing the grinding and polishing process, the floor is thoroughly cleaned and dried before applying the final treatments.

Terrazzo is a highly versatile and durable material that can stand the test of time. With proper maintenance, choosing terrazzo flooring will prove to be a worthwhile investment compared to other flooring systems.

 

Optimal Conditions for Substrate Preparation (Flooring)

 

  1. Concrete Substrate: The Required concrete class is a minimum of C16/20; recommended is C20/25.

  2. Minimum Compressive Strength: 25 daN/cm²

  3. Relative Humidity: Maximum allowable is 5%.

  4. Substrate Finish: Must be helicopter-finished concrete.

  5. Maximum Flatness Deviation: Deviation must be within ±3 to 5 mm over a radius of 3 meters.

Application Procedure for VIA.ZZO

 

  1. Preparation of Concrete Substrate:

Use diamond grinding or shot-blasting methods

  1. Application of Damp Proof Membrane (Hydraseal DPM):

Apply epoxy damp proof membrane (DPM) primer in two layers (600 g/sqm).

  1. Application of Elastomeric Membrane:

Self-leveling elastomeric membrane with a minimum thickness of 1.5 mm, acting as a crack-bridging system, reinforced with glass fiber mesh (minimum application of 2.5 kg/sqm).

  1. Design Implementation:

Incorporate flooring design drawings and metal color divider strips (brass/aluminium profiles).

  1. Application of Epoxy Terrazzo:

Conduct on-site material mixing and pouring (minimum 30.0 kg/sqm).

  1. Grinding, Grouting, and Polishing Procedures:

Three stages of diamond grinding, two stages of grouting, three stages of fine diamond grinding, and one to two polishing stages. – Conclude with final surface treatment using nano-lithium and ensure final pad polishing. This revised version enhances clarity while correcting any grammatical or punctuation errors.

Final Thickness: 12-14 mm after grinding and polishing

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